Smartcard Development Engineer

Help us simplify the world – beyond keys and pins!

We make things better – replacing keys and pins with biometrics – improving security, saving time and making life more convenient. With your curiosity, engagement, brilliant ideas and our knowledge of biometric technology, we can make genius things together!

About the company

Fingerprints is a leading global biometric company, and our solutions are integrated into millions of devices and applications and used billions of times every day. We develop and deliver secure and convenient identification and authentication systems and create value by facilitating the everyday lives of our global user base. Fingerprints biometric systems consist of sensors, algorithms, software and packaging technologies. Our success is built on product development with leading specialist competence that spawns world-leading products in terms of security, user convenience and performance.

When joining us, you will become a part of a friendly, diverse and skilled team where we encourage each other to collaborate, innovate and share experiences.

About the position

To further strengthen our Sensor packaging team in Gothenburg, we are now seeking additional development engineers, to contribute to our efforts with fingerprint sensors for smartcards.

Our Sensor packaging team is responsible for developing hardware solutions utilized in smartcard-based payment systems. More in detail this includes selecting proper IC packaging technology, evaluating adhesives and other critical materials used in assembly, running engineering builds at Asian or European sub-contractors, exploring coating options and executing reliability testing. The team is also creating complete system designs, including energy harvesting and on-card antenna design. Besides this, concepts are developed for coming product generations, technical support is provided to customers, as well as being part of developing in-house reference cards.

As a member of the Sensor packaging team, you will be heavily involved in exploring both traditional and future card embedding technologies, as well as advancing internal development of products and reference systems.

The right candidate matches one of the following profiles:

• Smartcard embedding / Card lamination process / Inlay design
• Have previous experience from smartcard embedding. For example, working with inlay design, card embedding technologies like ACF and solder, and/or or related components. Are excited about building further knowledge in the field of card embedding and to apply this expertise in product projects and ongoing customer engagements.
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• IC packaging / Reliability / OSAT interaction
• Previous experience from semiconductor development, especially within IC packaging. Have interacted with manufacturing facilities and are familiar with common assembly techniques and process flows. General knowledge about material behavior during stress, like delamination, warpage. Enthusiastic about taking an active role in developing new packaging concepts for sensor-based products.
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• Power harvesting / NFC
• Well acquainted with the technology used in energy harvesting schemes on handheld devices like contact less smartcards. Previous experience from component selection and system design, as well as system optimization, to reach target performance in an inductively powered device.
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• Packaging of TFT based solutions / COG / COF
• Good understanding of existing TFT manufacturing technologies, mechanical behavior and limitations for panels in user applications. Knowledge from non-display TFT solutions will be prioritized. Previous experience of embedding and interfacing TFT based hardware, including related bonding and encapsulation methods.

To succeed in this role, it is important that you..

• identify yourself with our values: SMART, BRAVE, OPEN, UNITED
• have a strong technical background and a keen interest in technological advancement
• have a positive problem-solving attitude and are open to unconventional ideas
• are able to drive assignments independently and to self-manage priorities
• are structured, ambitious and enjoy working in a small and entrepreneurial company.

Furthermore, you …

• have a Master or PhD in the relevant technology area, such as in physics, electronics, mechanics or materials
• speak and read English fluently
• enjoy interacting with external parties and suppliers, as well as customers if needed
• are able to travel internationally once or twice per year.

What Fingerprints can offer you

• Interesting challenges together with skilled and creative colleagues in an international setting
• Competitive benefits including health insurance, parental compensation, wellness contributions, etc.
• Modern work environment with flexible and dynamic work situation
• A learning culture with a possibility to grow and develop.

Sounds interesting?

Upload your application as soon as possible, but no later than Jan 16, 2022 at www.fingerprints.com/career. The selection process will start as soon as we receive applications. Please note that due to GDPR, applications by email will not be accepted.

For questions about this position, contact recruiting manager, Mats Slottner, Microelectronic Packaging Development R&D, +46 733 607838, Mats.slottner@fingerprints.com.

ABOUT THE PROCESS

To help us understand your profile better and break human biases as we believe in giving everyone an equal opportunity, we require all candidate who make it to the recruitment screening to complete our AlvaLabs Personality and Logical assessment. Do your best and good luck!

Come join our team of dedicated, bright and friendly people at Fingerprints!